JAE — Authorized in Israel
IL-AG5 Series
Ultra-fine 0.25 mm pitch wire-to-board connector for high-density internal interconnects in portable devices. The zero-insertion-force design minimizes assembly force, protecting fragile ultra-fine wires during manufacturing.

Key Features
- 0.25 mm pitch — industry-leading density
- ZIF design protects ultra-fine wires
- Compact low-profile housing
- Designed for robotic assembly
- Up to 30 positions
Specifications
Industries Served
Consumer ElectronicsMedicalTelecommunications
Interested in this connector?
Contact our Israeli team for pricing, availability, and technical support.
Get in TouchType
Wire-to-Board Connectors
Manufacturer
Japan Aviation Electronics Industry, Ltd.
Israeli Rep
RSTECH Electronics Ltd